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DARPA awards contract for development of advanced detection equipment

by: Matthew Potter
May 29, 2008

Category: Contract Awards, DARPA, development program | RSS 2.0

In a contract award not directly related to the SAIC one below, DAPRA awarded Bioident a contract to develop printed circuit board sensors. See an article here. The goal is to utilize Biodent’s process for making sheets with semiconductor material on them to reduce the size of sensors by incorporating the read out device on the board. Currently larger optical systems are used. No contract value was given, but it continues to demonstrate the amount of R&D the US is doing in such areas.

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